SMT--- "Surface Mount Technology" 

It is a surface-mounted technology, which is a relatively traditional installation method. Its disadvantage is that it is relatively large in size, which limits the miniaturization of the LCM.

-----------------------------------------

COB--- "Chip On Board"

That is, the chip is bonded (Bonding) on the PCB.

-----------------------------------------

TAB--- "Tape Aotomated Bonding"

It is the connection method of anisotropic conductive adhesive. The IC packaged in the form of TCP (Tape Carrier Package) is respectively fixed on the LCD and the PCB with anisotropic conductive glue. This installation method can reduce the weight and volume of the LCM, and it is easy to install and has better reliability!

-----------------------------------------

COG--- "Chip On Glass"

That is, the chip is directly bonded to the glass. This installation method can greatly reduce the volume of the entire LCD module, and is easy to produce in large quantities. It is more suitable for LCDs used in consumer electronic products, such as portable electronic products such as mobile phones and PDAs.

-----------------------------------------

COF--- "Chip On Film" 

That is, the chip is directly mounted on the flexible PCB. The integration of this connection method is relatively high, and the peripheral components can also be installed on the flexible PCB together with the IC, which is an emerging technology now.